target
application:

electronic semiconductor industry
characteristics:

rod: high purity, high cleanliness, good composition consistency, high density, uniform grain, and low resistivity. wire: god composition consistency, high elongation, high tensile strength, high roundness, smooth surface, and low resistivity. ingot: high purity, high cleanliness, good composition consistency, high density, uniform grain, and low resistivity;
parameter range:

rod: ø120 ~ 340 * l; wire: ø0.3- 6mm; high purity aluminum ingot: 560 * 270 * 1800mm
standards:

technical standards such as international standard iec61851 etc.
main products

bonding wire

ingot

lcd panel target blank

rod

semi-conductor target blank

wire

  • purity al99.99%-al99.9995% , high purity aluminum has uniform internal structure, low gas content (h < 0.15ppm, c / n / o < 10ppm), low slag content, good internal structure, composition consistency and stability.
  • ingot
  • purity≥al99.999% , high purity aluminum has uniform internal structure, low gas content (h < 0.15ppm, c / n / o < 10ppm), low slag content, good internal structure, composition consistency and stability
  • rod
  • purity≥al99.9995% , high purity aluminum has uniform internal structure, low gas content (h < 0.15ppm, c / n / o < 10ppm), low slag content, good internal structure, composition consistency and stability.
  • wire
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